For more information, contact Joel W. Sills, Langley Research Center, joel.w.sills@nasa.gov. Download PDF here Chip resistors are widely used in NASA projects, yet cases of alumina substrate cracking during environmental testing are rare. Two instances of thick-film chip resistor cracking were observed during thermal cycling after vibration, with fractures occurring across the short axis due […]
Category:
NASA Engineering and Safety Center
Posted on
November 3, 2026
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